The Filogic 330P chipset will later be used on laptops and desktop PCs AMD The next generation Ryzen-series. This is to deliver fast Wi-Fi speeds with low latency and reduced interference from other signals.
To optimize the 6E Series Wi-Fi module AMD RZ600 with a focus on delivering seamless connectivity experiences, AMD and MediaTek develops and certifies PCIe and USB interfaces for sleep and power management, which are essential elements of the modern customer experience.
Furthermore, the optimization process includes stress testing and ensuring compatibility standards, which can ultimately reduce development time for OEM customers.
“MediaTek already a leader in Wi-Fi technology in a number of different segments, including smart TVs, routers, and voice assistants. The new Filogic 330P chipset further expands our connectivity portfolio as we continue to expand our footprint in the PC market,” Alan Hsu, corporate vice president and general manager, Intelligent Connectivity at MediaTek.
“With high chipset throughput and yet very low power that laptops support AMD next generation, consumers can enjoy seamless connectivity and longer battery life while gaming, streaming, and video chat.”
The Filogic 330P supports the latest 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz to 7.125GHz) connectivity standards, along with Bluetooth 5.2 (BT/BLE). High-throughput and ultra-fast chipset with connectivity support up to 2.4Gbps, including support for the new 6GHz spectrum at 160MHz channel bandwidth.
This chipset also integrates power amplifier (PA) and low noise amplifier (LNA) technologies. MediaTek to help optimize power consumption and reduce footprint the design allows the Filogic 330P chipset to be embedded in laptops of all sizes.
Wi-Fi 6E Series module AMD RZ600 expands Wi-Fi capabilities AMD, providing an excellent connectivity solution for OEMs and end users, whether they are playing the latest interactive games, working remotely, or completing large projects.