Amkor Technology Expands Arizona Chip Packaging Campus to $12 Billion

Phase 2 Expansion Details and Cleanroom Capacity

According to Amkor Technology, strong customer demand has already surpassed the 33,000 square meters of cleanroom capacity originally planned for Phase 1. The newly announced Phase 2 expansion will add 60,000 square meters, bringing the total footprint of the Tempe campus to approximately 93,000 square meters of cleanroom space. According to corporate statements, construction on Phase 2 is anticipated to begin in late 2027, with final completion scheduled by the end of 2029.

Strategic Importance for U.S. Semiconductor Manufacturing

Located on a 170-acre site, the Arizona facility operates as the first outsourced semiconductor assembly and test (OSAT) production site in the United States capable of high-volume advanced packaging. According to Amkor Technology Chief Executive Officer Kevin Engel, the multi-phase campus provides domestic customers with a complete turnkey manufacturing platform for complex chip architectures. Together, Phase 1 and Phase 2 are expected to support a workforce of more than 3,500 employees in Arizona.

Key Project Metrics

• Total Investment: Approximately $12 billion, according to Amkor Technology.
• Total Cleanroom Space: Approximately 93,000 square meters across both phases.
• Construction Timeline: Phase 2 construction slated to begin in late 2027 and finish by the end of 2029, as reported by Business Wire.
• Job Creation: More than 3,500 Arizona-based positions supported by the combined phases.

Future Outlook

The 170-acre campus design leaves room for subsequent expansions beyond Phase 2 if long-term market demand dictates further growth. According to company disclosures, the facility targets high-end applications including artificial intelligence, smartphones, data centers, automotive systems, and wearable technology.