International Edition
Latest News
Technology

Apple Details A20 Pro Chip and Cooling in iPhone Duo

Apple Integrates Custom A20 Pro Chip, Metal-on-Foam Cooling, and Graphite Hinge Tubes in New iPhone Duo Apple's first foldable smartphone, the iPhone Duo, features a specialized A20 Pro chip variant designed alongside a unique "metal-on-foam" cooling material and…

Apple Details A20 Pro Chip and Cooling in iPhone Duo

Apple Integrates Custom A20 Pro Chip, Metal-on-Foam Cooling, and Graphite Hinge Tubes in New iPhone Duo

Apple’s first foldable smartphone, the iPhone Duo, features a specialized A20 Pro chip variant designed alongside a unique “metal-on-foam” cooling material and a flexible graphite hinge tube, 01net reported. While the standard iPhone 18 Pro and iPhone 18 Pro Max also house the A20 Pro processor, the folding model incorporates specific hardware modifications to manage its unique thermal and mechanical footprint.

Dual Display Engines Built for Folding Hardware

The A20 Pro chip inside the iPhone Duo includes a second display engine to operate the inner and outer screens simultaneously. Dan Murray, vice-president of semiconductor engineering at Apple, stated in an interview with PCMag that the inclusion guarantees a smooth user experience across both panels by using increased processor and graphics capabilities.

Metal-on-Foam Thermal Integration

To bridge the A20 Pro processor and the vapor chamber, Apple developed an internal material known as “metal-on-foam.” Banafsheh Barabadi, senior manager of thermal product design at Apple, told PCMag that the material dissipates heat efficiently while meeting strict mechanical system requirements. The component required months of development to optimize its material properties.

Apple A20 Pro LEAKS! 2nm Process, Faster CPU & GPU, Better Cooling and AI Upgrades

Flexible Graphite Hinge Management

Managing heat dissipation presented a major design hurdle because the device nearly doubles in volume when folded. Apple addressed the challenge by running a flexible graphite tube through the hinge to transfer heat between the two halves of the device. Barabadi noted that the joint development by thermal and mechanical teams produced a flexible component capable of withstanding numerous opening and closing cycles while maintaining its thermal conductivity and structural integrity.

About the author: Anika Shah - Technology

MSc in Computer Science, senior reporter. Anika focuses on AI ethics, cybersecurity, and emerging hardware—frequently moderating panels at CES and Web Summit. “Anika Shah decodes tech breakthroughs and startup disruption shaping tomorrow’s digital landscape.”