Hana Micron Recognized as Leading Semiconductor Post-Processing Solutions Provider

Hana Micron, a specialist in semiconductor post-processing (as well known as OSAT – Outsourced Semiconductor Assembly and Test), has been awarded the “2026 Asia Company of the Year for Semiconductor Post-processing Solutions” by Semiconductor Review magazine. This recognition highlights the company’s technological advancements and growing market influence in a critical segment of the semiconductor supply chain.

About Semiconductor Review

Semiconductor Review is a globally recognized international technology publication that provides in-depth coverage of trends and solutions within the semiconductor industry. Each year, the publication selects companies for recognition based on evaluations from a panel of industry experts, business leaders, and members of its editorial board.

Key Factors in Hana Micron’s Selection

According to media reports, Hana Micron’s innovative joint engineering model was a significant factor in its selection. This model fosters close collaboration with customers from the initial stages of project development, going beyond traditional manufacturing partnerships. The company’s expansion beyond its core competency in memory encapsulation, into areas like high-performance computing (HPC), also contributed to the award.

Comprehensive Turnkey Solutions

Hana Micron distinguishes itself by offering a complete turnkey solution for semiconductor post-processing. This encompasses the entire process, including wafer testing, packaging, final testing, and module assembly. This integrated approach is designed to enhance process efficiency and improve product reliability. The company’s ability to serve international clients is further strengthened by its Vietnamese subsidiary, which provides localized support and large-scale production capacity.

Technological Innovation: Heterogeneous Integration Chip (HIC)

Hana Micron’s next-generation encapsulation technology, the Heterogeneous Integration Chip (HIC), has garnered significant attention within the industry. HIC technology supports high-performance computing and the integration of complex chiplet-based systems through the implementation of 2.5D and 3D structures. The company’s research in this area, conducted in collaboration with international partners, was recognized at the ECTC 2025 (Electronic Components Technology Conference), where a joint research paper was selected as one of the top 20 submissions.

Future Outlook

A Hana Micron official stated that the award validates the company’s position as a leading solutions provider in the global market. Hana Micron plans to continue investing in research and development and strengthening its ability to deliver customized solutions to meet the evolving needs of its customers.

About Hana Micron

Established on August 23, 2001, Hana Micron Inc. Is a provider of high-value-added solutions related to semiconductor packaging [Hana Micron Sustainability Report 2023]. The company is led by CEO Dong-cheol Lee [Hana Micron SR2025_EN] and has a paid-in capital of KRW 24 billion [Hana Micron Sustainability Report 2023].