Intel Core Ultra: A Deep dive into the Revolutionary 18A Process
Table of Contents
Intel introduced new processors last week, the Core Ultra 300 series with the Panther Lake code name. It will replace the previous generation, which consisted of two entirely different products: Lunar Lake ultramobile chips and more powerful/more voracious Arrow Lake.
The company remained at the threshold construction, where each block produces a different process and then combines everything into one case on an active silicon pad. Ther will be two different processor, graphic and i/o bonds.
The processor produces the company itself the most advanced series – available Intel 18A technology, which for the first time introduces two new technologies: Ribbonfet transistors and backside Power Delivery.
Brand New Transistors
After more than 15 years, when all the main chips manufacturers switched to Finfet, we will have another revolution of transistors. They are named Gaffet (TSMC), Mbcfet (Samsung) or RibbonFET (Intel).
While in planar transistors, the gates touched only one (top side), at Finfets it has already interfered with both sides. But only in ribbonfet (and its alternatives to other manufacturers),the gates surround the channels from all four sides. Finfets folded the channels side by side horizontally, ribbonfets will lay them above each other. Such transistors can be reduced, so the silicon wafer is more effective.
Evolution of Transistors (Source: Samsung)
But the 18A process also brings another significant innovation – PowerVia. Intel cancels the established order, when a layer of transistors was in the chip down, while over it intertwined with signal and electricity wires.(In the case, the orientation switched off to make the transistors up and can cool better.)
Powervia separates data and electrical wires and the transistors remain in the middle. Benefits? The lower layers with electric wires will not suffer so much on voltage leaks, which will increase energy efficiency. The top layers with signal wires can thicken, so the chips could run at higher frequencies.
the Intel 18A process is expected to bring 15 % higher frequencies at the same consumption compared to Intel 3, or reduce consumption by 25 % at the same power. At the same time,the density of transistors per unit of the area increases by 30 %.
The Intel’s Specific Performance is Still Silent
Panther Lake contains new powerful cores (P-Cores) Intel has unveiled its Panther Lake architecture, poised to power a new generation of AI PCs expected to hit store shelves in early 2026. This new platform, built on the Intel 18A process node, represents a significant step forward in performance, connectivity, and AI capabilities. While building on the foundation of Lunar Lake, Panther Lake introduces key changes, including a move away from integrated memory and enhancements to the Neural Processing Unit (NPU) and video processing capabilities.Intel’s Panther Lake Architecture: A Deep Dive into the Next-Gen AI PC Platform
Key Specifications: Panther Lake vs. Lunar Lake & Meteor Lake
The following table summarizes key specifications of Panther Lake compared to its predecessors,Lunar Lake and Meteor Lake:
| Feature | Panther Lake | Lunar Lake | Meteor Lake |
|---|---|---|---|
| Memory Support | LPDDR5X-9600,DDR5-7200 (SO-DIMM/LPCAMM) | LPDDR5X-8533 | LPDDR5X-7467,DDR5-5600 |
| PCIe Support | 8x PCIe 4.0, 4x PCIe 5.0 | 8x PCIe 4.0, 4x PCIe 5.0 | 8x PCIe 4.0, 12x PCIe 5.0 |
| Connectivity | Wi-Fi 7, Bluetooth 6, up to 4x thunderbolt 4/5, 2x USB 3.2, 8x USB 2.0 | Wi-Fi 7, Bluetooth 6, up to 4x Thunderbolt 4/5, 2x USB 3.2,8x USB 2.0 | Wi-fi 7, Bluetooth 6, up to 4x Thunderbolt 4/5, 2x USB 3.2, 8x USB 2.0 |
Shifting Memory Architecture & Enhanced AI Performance
A notable change with Panther lake is the move away from integrated memory, a feature of Lunar Lake.Rather, Intel will utilize standard soldered LPDDR5X modules or DDR5 memory via SO-DIMM or LPCAMM slots. This provides greater flexibility and potentially lower costs for manufacturers.
The Neural processing Unit (NPU) receives a modest performance boost, increasing from at least 48 TOPS (Tera Operations Per Second) to 50 TOPS.Despite the incremental increase, Intel has focused on reducing the cost of the NPU while maintaining its efficiency. Intel highlights this as a key achievement.
Improved Video Processing Capabilities
Panther lake also features an upgraded video processor. The new architecture supports the decoding and encoding of H.264 and AV1 codecs, now including 10-bit color depth. Furthermore, it adds support for XAVC, a professional video format developed by Sony, enhancing its capabilities for content creators. Intel
Availability and Expected Launch Timeline
Intel anticipates that Panther Lake-powered computers will begin appearing in the market before the end of 2025, with wider availability expected in early 2026. Intel suggests that new laptop models from major manufacturers like Lenovo, HP, Dell, and Asus will likely be unveiled around January 2026.