Unlocking Next-Generation Embedded Systems with Samtec’s COM-HPC Connectors at Embedded World 2025
Berlin, Germany — At the forthcoming Embedded World 2025, Samtec is set to showcase its latest innovation—the COM-HPC (Computer-on-Module High-Performance Computing) connector solutions. Attendees will explore these cutting-edge connectors at Booth 4A-324, pushed to the forefront of evolving standards in high-speed embedded systems.
Harnessing High-Speed Data Transfer
Samtec’s COM-HPC connectors stand on the strong foundation of the AcceleRate HP High-Performance Arrays. These connectors are critical to both Server and Client modules, allowing two 400-pin connectors for a robust total of 800 pins in standard modules. Even the Mini module, tailored for space-constrained applications, maintains important functionality by focusing on key features without compromising data throughput or processing power.
The connectors excel with capabilities like PCIe 5.0 (32 Gbps), PCIe 6.0 (64 Gbps PAM4), 25 GbE, 40 Gbps USB4/Thunderbolt, and 80 Gbps DisplayPort. This high-speed performance is essential for modern embedded applications that require rapid data transfer and minimal latency.
Key Features and Benefits
- High-Speed Performance: With support for PCIe 5.0 and PCIe 6.0, these connectors are ready for the latest high-speed peripherals and advanced technologies.
- Scalability: Designed for Mini, Client, and Server modules, the connectors offer flexibility to meet various deployment needs.
- Standardized Form Factor: The consistent height of female Module Receptacles and configurable male Carrier Plugs (5 mm or 10 mm stack height) ensure seamless integration and interchangeability.
COM-HPC vs. COM Express: Understanding the Evolution
While both COM-HPC and COM Express serve as vital standards for Computer-on-Modules (CoMs), COM-HPC represents a significant evolution with its enhanced scalability and performance. As Samtec points out, COM-HPC surpasses the high-speed demands for embedded CoMs/SoMs and works in conjunction with the COM Express specification to foster advanced embedded system developments.
Module Types: Catering to Diverse Needs
COM-HPC modules come in three main types, each tailored to specific computational needs:
- Server Modules: Built for high-demand edge computing tasks, these modules offer substantial processing power and memory capacity.
- Client Modules: Ideal for general-purpose embedded applications, balancing performance with power efficiency.
- COM-HPC Mini: This compact design, introduced in the 1.2 update, caters to space-constrained environments without sacrificing essential functionalities. Version 1.3 is set to detail PCIe 6.0 performance specifications.
Future-Proofing Embedded Systems
COM-HPC connectors are designed to anticipate and adapt to evolving technological demands. Supporting up to 1 TB of system memory, the connectors accommodate a range of compute engines including RISC-V CPUs, GPGPUs, FPGAs, and DSPs. This versatility ensures that embedded systems can keep pace with future technological landscapes and application requirements.
Join Us at Embedded World 2025
Embedded World 2025 is the perfect venue to explore the innovations driving the next generation of embedded technologies. Make sure not to miss the opportunity to encounter Samtec’s COM-HPC connectors first-hand. Secure your free ticket here and connect with industry experts.
Conclusion
Assembled at the nexus of innovation, Samtec’s COM-HPC connectors represent a remarkable leap in embedded computing. By aligning with the latest industry standards and supporting diverse compute engines, these connectors stand poised to spearhead advancements across edge computing, industrial automation, and beyond. Don’t miss the chance to discover how COM-HPC could revolutionize your next embedded project. Register to learn more about these groundbreaking solutions!
Visionary Insights: The Future of Embedded Computing
In our exclusive interview with Ian MacDonald, Senior Product Manager at Samtec, we delve into the future of embedded computing. Ian expressed excitement about the possibilities edge computing offers and how innovations like COM-HPC will drive the industry forward. With advances in processing power, memory, and connectivity, embedded systems are set to become even more integral to our everyday lives.
Join us in exploring the transformative potential of COM-HPC at Embedded World 2025.